Drivers Optic Dual-touch Team Input Devices

Looking in device manager - the audio devices all say working OK. But on bar at bottem of screen get speaker with red cross - Playing audio - Audio trouble shouter cannot find any problems. Sound settings say - No output or Input devices found. Have tried to re-install Realtek audio drivers for motherboard - installed but no change. The Planar PXL2230MW 22' dual-touch Full HD widescreen edge-lit LED LCD is optimized for consumer multimedia applications. Designed for Microsoft Windows® 10, the monitor features an optical dual-touch screen (USB interface). The Planar PXL2230MW offers VGA, DVI-D and HDMI video inputs for flexible monitor set-up and integrated speakers. 'This includes all the drivers for linux, Windows, Solaris, Netware, NDIS, etc. I have successfully used the NDIS drivers to create Ghost boot disks for a Dell D600 Latitude (it's built-in NIC).' Broadcom 5904 Driver 3Com Device Type: Network Devices Supported OS: Win ME, Win 98SE, Win 98, Win 95 File Version: Version.0 Release Date.

The 2Qute is our entry level ”straight’ DAC (no headphone amp) and is an evolutionary product which has scooped a number of press awards in recent years. The 2Qute is undoubtedly a super-DAC for the modern age and features class-leading specification, outstanding technical measurements and proven sonic performance.

The 2Qute advances our much-loved Qute EX DAC with Hugo specification. Essentially a Hugo in a Chordette chassis, it brings the latest FPGA DAC technology into an affordable home-system-orientated unit. 2Qute contains the same high-performance Spartan 6 FPGA that has enabled Hugo to redefine the DAC genre since its launch. The 2Qute also boasts astonishingly low distortion levels of 0.0003%.

The 2Qute offers support for up to 32-bit/384kHz audio via coax and USB, and 24-bit/192kHz over optical. DSD64 is supported on all inputs and DSD128 is supported via coax or USB (all via DoP). The unit also gains a handy switch to easily move between coax, optical and USB digital inputs.

The device features a Class 2 USB input which, because of the 2Qute’s home-system orientation compared to Hugo’s more mobile aspirations, has been galvanically isolated for greater sonic performance. This has been achieved using a novel technique which allows for very high data rates of up to 384kHz; the input is driverless on Apple and Android devices, with (ASIO included) drivers for Windows devices.

Join Our Team

Our current openings are listed below, however, we welcome all qualified individuals to submit their application. Please use the form on the right to tell us about yourself and submit your resumé.

Senior Process Engineer

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Process Engineer to support NPI and Manufacturing Processes.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define and design best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process design and development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include:

Support and own the complete assembly process flow of the OE (Module) product:

Passive optical and mechanical/packaging assembly sequencing, design and development
Part placement, adhesive dispense, adhesives curing parameters, metrology
Material and sub-components management (including supplier audit)
Active optical alignment processes, development and optimization
Work on related wafer dicing processes
Ensure reliability parameters are understood and addressed for the assembly process (de-risked as required for sub-assemblies)
Work in conjunction with Ranovus’ Design teams & Contract Manufacturing Partners to develop, improve and optimize assembly processes to support high volume production. Analyze, track, evaluate quality of the assemblies coming from the CMs.
Work with CMs in acceptance and commissioning process of future micro assembly machine to support product ramp
Work with CMs to ensure processes for wafer level testing, and other assembly test steps are well defined, with optimized processes
Monitor process data continuously, report on yield, throughput, defect rates, root cause analysis of defects, etc.

Required skills and experience include:

Experience with Photonic, Laser, and ASIC components and micro-assembly;
Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
5-10 years of solid experience in related work;
Excellent ability to solve technical, scientific and experimental problems;
Excellent teamwork and communication skills;

Required education:

A post graduate degree in a relevant field: Electronics, Optics, Physics or equivalent studies.
Candidates with a bachelors degree will be considered commensurate with relevant experience.

Senior Hardware Design Engineer

We are seeking a Senior Hardware Design Engineer to join our R&D team in Ottawa.

Responsibilities generally include:

Provide input to HW design architecture
Conduct peer design reviews
Aid in definition of circuit pack functional requirements
Aid in Component engineering including selection, coding and review.
Capture circuit level schematics
Design Simulation
Develop Stackups
Manage PCB layout resources
Work with high-speed RF transmission lines
Bring up, debug and characterization of designs
Author, maintain and contribute to design documentation including:
- Product System Requirements,
- Functional Specifications,
- Hardware Design Specifications,
- Verification Test Plans,
- ECO Documentation and Design Release

Requirements:

Bachelors Degree in Electrical Engineering or equivalent.
A minimum of 7+ years of relevant experience in progressive roles.
Board level design experience including:
- High-speed digital circuits,
- Analog circuits,
- Power supply design,
- Processors and microcontrollers,
- Clock distribution,
- FPGAs
Experience designing with Thermal management
Experience in EMI/EMC Compliance
Experience in Schematic Capture tools (Cadence)
Experience with PCB Layout Design Tools (Cadence Allegro)
Experience with signal integrity analysis
Experience with HW tracking and testing
Experience with Lab Characterization tools:
Oscilloscopes, DVM, Spectrum Analyzers, Optical test equipment
Experience in a lab environment including trouble shooting issues
Proven self-starter and team player

Senior RF IC Design Engineer

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data centers.

We are seeking several RF IC Design Engineers to join our team in Ottawa and Nuremberg.

As a successful candidate you will work in a team responsible for development of advanced mixed signal analog/RF ICs products. These ICs include classical RF analog circuits such as Transimpedance Amplifier and Drivers for high-speed optical links as well as low-speed ADCs, DACs and proprietary mixed-signal circuits.

This position has responsibility for:

Drivers Optic Dual-touch Team Input devices

Develop and deploy novel Analog/RF IC circuits for TX and RX at 30+Gbps
Lab characterization and system performance tests and system development activities
Multi-disciplinary collaboration with experts from other domains
Tenacity and propensity to do what it takes to deliver results and meet delivery dates

Skills and experience

7+ years experience in high-speed electrical IC design
Fundamental knowledge of Analog and/or RF IC design, layout and verification methodologies
Fluency in RF system-level specifications
Knowledge of optical communications and key building blocks like TIA, Driver, CDR, Equalizers, Photodiode, Modulator
Understanding of RF device modeling, including but not limited to device noise parameters, mismatch, linearity and inductor modeling
Insights into packaging effects, supply isolations, high frequency ESD structures, and circuit layout for optimum RF performance
Experience in lab characterization
Experience with IC production and foundry interaction
Demonstrated track record delivering quality products in complete product cycles
Ability to assume technical lead role to lead and mentor more junior design staff
Experience work with outsourced subsystem design teams
Strong team player
Fluency in English language

RF IC Design Engineer

We are seeking several RF IC Design Engineers to join our team in Ottawa and Nuremberg.

This position has responsibility for:

Develop and deploy novel Analog/RF IC circuits for TX and RX at 30+Gbps
Lab characterization and system performance tests and system development activities
Multi-disciplinary collaboration with experts from other domains
Tenacity and propensity to do what it takes to deliver results and meet delivery dates

Skills and experience

Drivers Optic Dual-touch Team Input Devices Free

Minimum of 3 years experience in high-speed electrical IC design
Fundamental knowledge of Analog and/or RF IC design, layout and verification methodologies
Fluency in RF system-level specifications
Knowledge of optical communications and key building blocks like TIA, Driver, CDR, Equalizers, Photodiode, Modulator
Understanding of RF device modeling, including but not limited to device noise parameters, mismatch, linearity and inductor modeling
Insights into packaging effects, supply isolations, high frequency ESD structures, and circuit layout for optimum RF performance
Experience in lab characterization
Experience with IC production and foundry interaction
Demonstrated track record delivering quality products in complete product cycles
Ability to assume technical lead role to lead and mentor more junior design staff
Experience work with outsourced subsystem design teams
Strong team player
Fluency in English language

Submit Your Application

Please complete the form below to submit your application to RANOVUS.

Drivers Optic Dual-touch Team Input Devices -

RANOVUS is a leading provider of multi-terabit interconnect solutions for datacenter and communications networks. With operations in Canada, USA, and Germany, RANOVUS develops and manufactures advanced solutions for the next generation of interconnects for the telecommunications and information technology industries. Our team has extensive experience in product development and commercialization of optoelectronics components and transceiver subsystems for the information technology industry.

Drivers Optic Dual-touch Team Input Devices Software

RANOVUS’ current disruptive portfolio includes Quantum Dot Multi-Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.